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UT’s Penumadu Helps Develop Breakthrough Adhesive

The UT Research Foundation and the Department of Civil and Environmental Engineering recently submitted a patent application on behalf of Fred N. Peebles Professor Dayakar Penumadu for a new type of adhesive.

Called a “smart joint” system, the technology has a number of key features and applications and is characterized by being lightweight, flexible, inexpensive, and easy-to-install.

It consists of distributed optical fiber sensors that provide critical stress, strain and temperature information to designers and manufacturers working with advanced materials.

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